Plasma Cleaning
The operational cost of using plasma cleaning systems are low, while providing the highest quality in cleaning surfaces. Another benefit of using a plasma cleaning system is that it eliminates the need to use chemical solvents.
Ultra fine cleaning of surfaces with cold atmospheric pressure plasmas is a process of removing organic, inorganic and microbial surface contaminants, as well as strongly adhering dust particles. It is highly efficient and at the same time very gentle to the treated surface. At higher strength, it can remove weak surface boundary layers, cross-link surface molecules and even reduce hard metal oxides. Plasma cleaning promotes wettability and adhesion enabling a wide spectrum of industrial processes preparing surfaces for bonding, gluing, coating and painting. While being performed using air or typical industrial gases including hydrogen, nitrogen and oxygen, it avoids wet chemistry and expensive vacuum equipment, which positively affects its costs, safety and environmental impact. Fast processing speeds further facilitate numerous industrial applications.
As a result, using plasma cleaning eliminates the need for storage facilities or for making arrangements for solvent waste disposal. Plasma is a proven and effective method for critical surface preparation.
- Oxygen-Based Plasma Cleaning
- Hydrogen-Based Plasma Cleaning
- Argon-Based Plasma Cleaning
Plasma Simulation
Research and Development in Plasma Technologies
Simulation of Complex Systems to Gain Most Optimized Configuration with Advanced Technology
Magnetized plasma simulations of realistic devices using the kinetic or the multi-fluid plasma models are examples that benefit from high-order accuracy. The multi-fluid plasma model only assumes local thermodynamic equilibrium within each fluid, e.g. ion and electron fluids for the two-fluid plasma model.
Plasma Dynamics use advanced electromagnetic FEA, CFD and particle-in-cell (PIC) codes, designed for executing multi-scale, plasma physics simulations. Based on the problem and its detail, we use special commercial code or even develop new codes and subroutines to capture the interaction between charged particles (electrons and ions) and external and self-generated electric and magnetic fields.
Advanced Technology for Industry

With Detailed Design and Comprehensive Optimization
